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ProVia-H™ Via Driller Models |
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The ProVia-H workstation models utilize the production-proven hybrid processing approach. The UV laser is first used to drill openings of the required size in the top copper foil. This process is followed closely with an RF-CO2 laser to drill the exposed dielectric. The copper of the stop pad will reflect the CO2 light, permitting aggressive drilling of even the toughest materials (e.g. high glass content, high Tg FR4) without damage to the stop pad.
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ProVia-H |
| Hybrid system for maximum versatility |
| Integrated laser machining tool for high volume production |
| Configured for a variety of applications: |
| ·blind via and through-hole drilling |
| ·circuit excising, cutting and routing |
| ·defect repair |
| APSTM for superior process quality |
| Horizontal or semi-vertical load/unload |
| Slip sheet and panel flipper options |
| Windows® operator interface |
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Data sheet Questions? ProVia data sheet
Laser drilling of microvias is now commonplace in the electronics packaging industry, allowing high density circuits to be made for a range of products from cellular phones and other hand-held devices to chip on flex, multi-chip modules, and PCMCIA cards.
The ProVia drillers provide the ultimate processing workstations for rigid boards, with high performance galvos for rapid point-to-point drilling and precise control for fine features. The CO2 laser is appropriate for high speed machining (drilling, cutting and skiving) of dielectrics, while the UV laser is able to machine copper and provide higher cut quality in many dielectrics. An optional second galvo head for CO2 -only or UV-only systems can increase drilling speeds up to 2X over the standard single-head configuration. Whether your application is with glass- and aramid-reinforced epoxies or non-reinforced materials (e.g. resin-coated foil), there is a ProVia model to meet your requirements.
Specifications*
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System Hardware |
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· High peak power RF-excited CO2 laser and diode-pumped solid state UV laser (3W to 24W models available) |
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· Configured with high performance galvanometer scanners for high speed via drilling, skiving, and cutting |
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· Three drilling modes: hybrid, conformal mask CO2 and direct CO2 |
| · Galvanometer scanning field: 50x50 mm |
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· Maximum panel size 533mm x 635mm
(21" x 25") |
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· Vacuum platen for panel hold-down |
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· Integrated power meter for process control |
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· Precision linear motor XY stages with high resolution encoder feedback |
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· High performance motion and laser controller |
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· CDRH Class 1 enclosure |
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· Large process viewing window |
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· Automated vision system for precision alignment, and scaling, offset, trapezoidal and rotation compensation |
| · Beam placement accuracy: 15µm (3 sigma) over panel process area |
| · Ultrastable steel weldment frame with resonance dampening |
| · Compliant with CE and North American regulations |
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· Optional automatic panel loader/unloader |
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Utilities |
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· Electrical: 208 VAC, three phase, 5-wire "WYE", 35A, 60Hz; or 400 VAC, three phase, 5-wire "WYE", 20A, 50Hz. |
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· Exhaust: ablation debris removal through 3" (76mm) diameter duct, 100 SCFM typical |
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· Dimensions (HxWxD): 93"x64"x86"
2356mm x 1626mm x 2192mm |
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· Weight: 2813 kg (6233 lbs) net |
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· Water: 8 l/min, or optional closed cycle chiller |
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System Control |
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· Windows XP® based user interface |
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· User friendly operator screens |
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· Compatible with all industry standard file formats |
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· Rapid drill file conversion and path optimization utility. |
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· System monitoring for process integrity |
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· Full system diagnostics |
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· Saving of multiple job parameter files |
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· Password protection for access to configuration, set-up, and operating screens |
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· Emergency stop and safety interlock circuits |
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· Optional network interface |
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Process Parameters |
| · Active Pulse ShapingTM for the CO2 laser to optimize process quality |
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· Point-to-point moves, continuous line and area scanning, and circuit excising |
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· Programmable laser pulse rate, pulse overlap, and scanning area |
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· Tool creation function |
| · Automatically process stepped vias |
| · Via sizes down to 40µm using UV and 80µm using CO2 |
| · Via roundness error: 10% maximum |
| · Drilling rates up to 500 blind vias/sec within galvo field |
| · Cutting rates up to 1000 mm/sec (CO2), 100mm/sec (UV) |
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| · Consult PPI for processing rates in your material. |
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| * specifications are subject to revision and change | | |
(주)드림포토닉스
Mobile: 010-8781-0630
Tel: 031-695-6055 Fax: 031-695-6056
www.processphotonics.com
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